[K-4-3] Electrostatic Temporary Bonding Tech. and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration

H. Hashiguchi¹、J. C. Bea²、Y. Ohara¹、T. Fukushima²、K. W. Lee²、T. Tanaka^1,3、M. Koyanagi² (1.Dept. of Bioengineering and Robotics, Tohoku Univ.、2.New Industry Creation Hatchery Center , Tohoku Univ.、3.Dept. of Biomedical Engineering, Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2012.K-4-3