[K-4-3] Electrostatic Temporary Bonding Tech. and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration

H. Hashiguchi¹, J. C. Bea², Y. Ohara¹, T. Fukushima², K. W. Lee², T. Tanaka^1,3, M. Koyanagi² (1.Dept. of Bioengineering and Robotics, Tohoku Univ., 2.New Industry Creation Hatchery Center , Tohoku Univ., 3.Dept. of Biomedical Engineering, Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2012.K-4-3