[K-5-2] Dominant Structural Factors of Residual Stress Distribution in Stacked Silicon Chips Mounted in 3D Packages and Modules

K. Suzuki¹、H. Tago¹、F. Endo¹、N. Murata¹、H. Miura¹ (1.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2012.K-5-2