TSV Scaling with Constant Liner Thickness and the Related Implications on Thermo-mechanical Stress, Capacitance, and Leakage Current

C. S. Tan; J. Zhang; K. Ghosh; L. Zhang; Y. Dong; H. Yu; C. M. Tan; G. Xia

doi:https://doi.org/10.7567/SSDM.2012.K-5-3

[K-5-3] TSV Scaling with Constant Liner Thickness and the Related Implications on Thermo-mechanical Stress, Capacitance, and Leakage Current

C. S. Tan¹, J. Zhang¹, K. Ghosh¹, L. Zhang¹, Y. Dong³, H. Yu², C. M. Tan¹, G. Xia³ (1.Nanyang Technological Univ., 2.Inst. of Microelectronics , Singapore, 3.Univ. of British Columbia , Canada)

https://doi.org/10.7567/SSDM.2012.K-5-3

2012 International Conference on Solid State Devices and Materials

[K-5-3] TSV Scaling with Constant Liner Thickness and the Related Implications on Thermo-mechanical Stress, Capacitance, and Leakage Current