TSV Scaling with Constant Liner Thickness and the Related Implications on Thermo-mechanical Stress, Capacitance, and Leakage Current

C. S. Tan; J. Zhang; K. Ghosh; L. Zhang; Y. Dong; H. Yu; C. M. Tan; G. Xia

doi:https://doi.org/10.7567/SSDM.2012.K-5-3

[K-5-3] TSV Scaling with Constant Liner Thickness and the Related Implications on Thermo-mechanical Stress, Capacitance, and Leakage Current

C. S. Tan¹、J. Zhang¹、K. Ghosh¹、L. Zhang¹、Y. Dong³、H. Yu²、C. M. Tan¹、G. Xia³ (1.Nanyang Technological Univ.、2.Inst. of Microelectronics , Singapore、3.Univ. of British Columbia , Canada)

https://doi.org/10.7567/SSDM.2012.K-5-3

2012 International Conference on Solid State Devices and Materials

[K-5-3] TSV Scaling with Constant Liner Thickness and the Related Implications on Thermo-mechanical Stress, Capacitance, and Leakage Current