[PS-2-1] Investigation of Electrical Performances for n-MOSFET Devices Integrating with Bonding and Thinning Technologies in 3D Integration

C. A. Cheng¹, C. H. Lu², C. H. Ho³, K. N. Chen⁴ (1.National Chiao Tung Univ., 2.National Chiao Tung Univ., 3.National Nano Device Lab., 4.National Chiao Tung Univ. , Taiwan)

https://doi.org/10.7567/SSDM.2012.PS-2-1