The Japan Society of Applied Physics

[PS-2-1] Investigation of Electrical Performances for n-MOSFET Devices Integrating with Bonding and Thinning Technologies in 3D Integration

C. A. Cheng1、C. H. Lu2、C. H. Ho3、K. N. Chen4 (1.National Chiao Tung Univ.、2.National Chiao Tung Univ.、3.National Nano Device Lab.、4.National Chiao Tung Univ. , Taiwan)

https://doi.org/10.7567/SSDM.2012.PS-2-1