[PS-2-4] Grapho-Assembly Tech. for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps

T. Fukushima¹, M. Onishi¹, J. Bea¹, S. Hioki¹, M. Murugesan¹, K. Lee¹, T. Tanaka², M. Koyanagi¹ (1.New Industry Creation Hatchery Center (NICHe), 2.Dept. of Biomedical Engineering, Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2012.PS-2-4