[PS-2-4] Grapho-Assembly Tech. for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps

T. Fukushima¹、M. Onishi¹、J. Bea¹、S. Hioki¹、M. Murugesan¹、K. Lee¹、T. Tanaka²、M. Koyanagi¹ (1.New Industry Creation Hatchery Center (NICHe)、2.Dept. of Biomedical Engineering, Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2012.PS-2-4