The Japan Society of Applied Physics

2012 International Conference on Solid State Devices and Materials

2012 International Conference on Solid State Devices and Materials

Sep 25, 2012 - Sep 27, 2012
Kyoto International Conference Center, Kyoto, Japan

[PS-2-6] Analysis of Local Bending Stress Effect on CMOS Performance Fabricated in Thinned Si Chip for Chip-to-Wafer 3D Integration

H. Kino1, J. C. Bea1, M. Murugesan1, K. W. Lee1, T. Fukushima1, T. Tanaka1, M. Koyanagi1 (1.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2012.PS-2-6