[G-7-2] Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D IC H. Kino1, T. Fukushima1, K.W. Lee1, M. Koyanagi1, T. Tanaka1 (1.Tohoku Univ. (Japan)) https://doi.org/10.7567/SSDM.2013.G-7-2