15 μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for Advanced Chip Stacking Applications

[K-1-5] 15 μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for Advanced Chip Stacking Applications

T.T. Bui¹、F. Kato¹、N. Watanabe¹、S. Nemoto¹、K. Kikuchi¹、M. Aoyagi¹ (1.National Inst. of Advanced Indus. Sci. and Tech. (AIST) (Japan))