[K-1-6] Self-Assembly Study to Precisely Align Dies Having Microbump Covered with Non-Conductive Film for Advanced Chip-to-Wafer 3D Integration

Y. Ito^1,2、T. Fukushima¹、K.W. Lee¹、K. Choki²、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ.、2.Sumitomo Bakelike Co., Ltd. (Japan))

https://doi.org/10.7567/SSDM.2013.K-1-6