[K-1-6] Self-Assembly Study to Precisely Align Dies Having Microbump Covered with Non-Conductive Film for Advanced Chip-to-Wafer 3D Integration

Y. Ito^1,2, T. Fukushima¹, K.W. Lee¹, K. Choki², T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ., 2.Sumitomo Bakelike Co., Ltd. (Japan))

https://doi.org/10.7567/SSDM.2013.K-1-6