[PS-14-1] Investigation of Via Degradation Behavior under Thermal Cycling Stress on Power Device

M. Zhang¹、Y. Yoshihisa¹、K. Furuya²、Y. Imai¹、K. Hatasako¹、S. Maegawa¹ (1.Renesas Electronics Corp.、2.Renesas Semiconductor Engineering Corp. (Japan))

https://doi.org/10.7567/SSDM.2013.PS-14-1