[PS-14-15L] Heavy Ribbon Wire Bonding for Advanced Power Module Packages

S.M. Park¹, S. Nagao¹, T. Sugahara¹, K. Suganuma¹ (1.Inst. Sci. Indus. Res., Osaka Univ. (Japan))

https://doi.org/10.7567/SSDM.2013.PS-14-15L