The Japan Society of Applied Physics

[A-1-3] Interface Engineering in Homogeneous Barrier Modulation RRAM for 3D Vertical Memory Applications

W.L. Lai1, C.T. Chou1, C.W. Hsu1, J.C. Liu1, B. Hudec1, C.H. Ho2, W.Y. Jang2, C.H. Lin2, T.H. Hou1 (1.NCTU, 2.Winbond Electronics Corp. (Taiwan))

https://doi.org/10.7567/SSDM.2014.A-1-3