[G-1-3] Ultrawideband Ultralow PDN Impedance of Decoupling Capacitor Embedded Interposers Using Narrow Gap Chip Parts Mounting Technology for 3-D Integrated LSI System
K. Kikuchi1, M. Ujiie2, M. Aoyagi1, S. Takayama2
(1.AIST, 2.Arena Co., Ltd. (Japan))
https://doi.org/10.7567/SSDM.2014.G-1-3
