[G-1-4] Characterization of Vapor Deposited Polyimides and Process Integration with the Polymeric Liner for Via-Last/Backside-Via Cu-TSV Formation

T. Fukushima¹, M. Mariappan¹, J.C. Bea¹, K.W. Lee¹, M. Koyanagi¹ (1.Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2014.G-1-4