[G-2-2] Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC

Y. Sugawara¹, H. Hashiguchi¹, S. Tanikawa¹, H. Kino², K. Lee³, T. Fukusima³, M. Koyanagi³, T. Tanaka^1,2 (1.Dept. of Bioengineering and Robotics, Tohoku Univ., 2.Dept. of Biomedical Engineering, Tohoku Univ., 3.NICHe, Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2014.G-2-2