The Japan Society of Applied Physics

[G-2-2] Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC

Y. Sugawara1, H. Hashiguchi1, S. Tanikawa1, H. Kino2, K. Lee3, T. Fukusima3, M. Koyanagi3, T. Tanaka1,2 (1.Dept. of Bioengineering and Robotics, Tohoku Univ., 2.Dept. of Biomedical Engineering, Tohoku Univ., 3.NICHe, Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2014.G-2-2