[G-2-4] Suppression of Cu Ion Drift by Metal-Cap on Cu lines, Improving Interconnect Dielectric Reliability

M. Ueki¹、N. Furutake¹、N. Inoue¹、Y. Hayashi¹ (1.Renesas Electronics Corp. (Japan))

https://doi.org/10.7567/SSDM.2014.G-2-4