3D Sequential Integration via Direct Bonding of Highly Conductive Sputtered Tungsten Films

L. Benaissa

doi:https://doi.org/10.7567/SSDM.2015.E-2-5

2015 International Conference on Solid State Devices and Materials

2015年9月27日〜 2015年9月30日
Sapporo Convention Center, Sapporo, Japan

17:45 〜 18:05

[E-2-5] 3D Sequential Integration via Direct Bonding of Highly Conductive Sputtered Tungsten Films

^○L. Benaissa^1,2, P. Gondcharton^1,2, B. Imbert^1,2, C. Sabbione^1,2, G. Rodriguez^1,2, D. Mariolle^1,2, D. Lafond^1,2 (1.Univ. Grenoble Alpes, 2.CEA-LETI, MINATEC Campus(France))

https://doi.org/10.7567/SSDM.2015.E-2-5

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