5:45 PM - 6:05 PM

[E-2-5] 3D Sequential Integration via Direct Bonding of Highly Conductive Sputtered Tungsten Films

^○L. Benaissa^1,2, P. Gondcharton^1,2, B. Imbert^1,2, C. Sabbione^1,2, G. Rodriguez^1,2, D. Mariolle^1,2, D. Lafond^1,2 (1.Univ. Grenoble Alpes, 2.CEA-LETI, MINATEC Campus(France))

https://doi.org/10.7567/SSDM.2015.E-2-5