Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor

Y. Takemoto

doi:https://doi.org/10.7567/SSDM.2015.E-4-3

4:20 PM - 4:40 PM

[E-4-3] Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor

^○Y. Takemoto¹, N. Takazawa¹, M. Tsukimura¹, H. Saito¹, T. Kondo¹, H. Kato¹, J. Aoki¹, K. Kobayashi¹, S. Suzuki¹, Y. Gomi¹, S. Matsuda¹, Y. Tadaki¹ (1.Olympus Corp.(Japan))

https://doi.org/10.7567/SSDM.2015.E-4-3

2015 International Conference on Solid State Devices and Materials

[E-4-3] Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor