Evaluation of InAs HEMT with Non-alloyed Ohmic Contacts & Mesa Sidewall Etch for RF and Low-Power Logic Applications

K. C. Yang

doi:https://doi.org/10.7567/SSDM.2015.M-1-2

2:30 PM - 2:45 PM

[M-1-2] Evaluation of InAs HEMT with Non-alloyed Ohmic Contacts & Mesa Sidewall Etch for RF and Low-Power Logic Applications

K. C. Yang¹, ^○J. N. Yao¹, H. H. Hsu¹, Y. C. Lin¹, H. T. Hsu², J. S. Maa¹, E. Y. Chang¹, H. Iwai³ (1.National Chiao Tung Univ., 2.Yuan Ze Univ., 3.Tokyo Tech(Taiwan))

https://doi.org/10.7567/SSDM.2015.M-1-2

2015 International Conference on Solid State Devices and Materials

[M-1-2] Evaluation of InAs HEMT with Non-alloyed Ohmic Contacts & Mesa Sidewall Etch for RF and Low-Power Logic Applications