A Novel Low Temperature (<500°C) and Low-κ (3.8) Boron Nitride PECVD Offset Spacer Featuring 3D VLSI Integration

C. M. V. Lu

[PS-2-13] A Novel Low Temperature (<500°C) and Low-κ (3.8) Boron Nitride PECVD Offset Spacer Featuring 3D VLSI Integration

^○C. M. V. Lu^1,2, C. Bout¹, C. Fenouillet Beranger¹, A. Roule¹, M. P. Samson^1,2, B. Previtali¹, C. Arvet^1,2, A. Michallet^1,2, N. Rochat¹, S. Favier^1,2, R. Kachtouli¹, V. Loup¹, BessonP. ^1,2, M. Garcia Barros^1,2, N. Posseme¹, F. Pierre¹, P. Maury², D. Benoit², P. Batude¹, M. Vinet¹, T. Skotnicki² (1.CEA-LETI, MINATEC Campus, 2.STMicroelectronics(France))

2015 International Conference on Solid State Devices and Materials

[PS-2-13] A Novel Low Temperature (<500°C) and Low-κ (3.8) Boron Nitride PECVD Offset Spacer Featuring 3D VLSI Integration