Local Stress Effect Due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC

2015 International Conference on Solid State Devices and Materials

Sep 27, 2015 - Sep 30, 2015
Sapporo Convention Center, Sapporo, Japan

^○H. Kino¹, H. Hashiguchi¹, S. Tanikawa¹, Y. Sugawara¹, S. Ikegaya¹, T. Fukusima¹, M. Koyanagi¹, T. Tanaka¹ (1.Tohoku Univ.(Japan))