10:00 〜 10:20

[M-5-02] Quality and Reliability Investigation of Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique

^○T. -Y. Yu¹, H. -W. Liang¹, Y. -J. Chang¹, K. -N. Chen¹ (1.NCTU(Taiwan))

https://doi.org/10.7567/SSDM.2016.M-5-02