10:00 AM - 10:20 AM
[M-5-02] Quality and Reliability Investigation of Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique
○T. -Y. Yu1, H. -W. Liang1, Y. -J. Chang1, K. -N. Chen1
(1.NCTU(Taiwan))
https://doi.org/10.7567/SSDM.2016.M-5-02