09:30 〜 09:50

[O-5-01] Demonstration of Ultra-Thin Buried Oxide Germanium-on-Insulator MOSFETs by Direct Wafer Bonding and Polishing Techniques

^○Z. Zheng¹, X. Yu¹, M. Xie¹, R. Cheng¹, R. Zhang¹, Y. Zhao¹ (1.Zhejiang Univ.(China))

https://doi.org/10.7567/SSDM.2016.O-5-01