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[PS-1-06] Influence of Low Thermal Budget Plasma Oxidation and Millisecond Laser Anneal on Gate Stack Reliability in view of 3D Sequential Integration

^○C. -M. V. Lu^1,2, C. Fenouillet-Béranger¹, R. Gassilloud¹, H. Graoui³, D. Larmagnac⁴, S. Sharma³, X. Garros¹, C. Leroux¹, A. Toffoli¹, G. Romano^1,2, R. Kies¹, N. Rambal¹, M. -P. Samson², B. Previtali¹, C. Guedj¹, N. Bernier¹, S. Kerdiles¹, L. Brunet¹, P. Batude¹, T. Skotnicki², M. Vinet¹ (1.CEA-LETI(France), 2.STMicroelectronics(France), 3.Applied Materials Inc.(USA), 4.Applied Materials France(France))

https://doi.org/10.7567/SSDM.2016.PS-1-06