Achieving BEOL Footprint-Efficient and Low Cost Monolithic 3D<sup>+ </sup>IoT Chip Using Low Thermal Budget Laser Technology

C. -C. Yang

doi:https://doi.org/10.7567/SSDM.2017.E-6-01

11:15 〜 11:45

[E-6-01 (Invited)] Achieving BEOL Footprint-Efficient and Low Cost Monolithic 3D⁺IoT Chip Using Low Thermal Budget Laser Technology

^○C. -C. Yang¹, T. -Y. Hsieh¹, W. -H. Huang¹, J. -M. Shieh¹, H. -H. Wang¹, C. -H. Shen¹, F. -K. Hsueh¹, W. -K. Yeh¹ (1.National Nano Device Labs. (Taiwan))

https://doi.org/10.7567/SSDM.2017.E-6-01

2017 International Conference on Solid State Devices and Materials

[E-6-01 (Invited)] Achieving BEOL Footprint-Efficient and Low Cost Monolithic 3D+ IoT Chip Using Low Thermal Budget Laser Technology

[E-6-01 (Invited)] Achieving BEOL Footprint-Efficient and Low Cost Monolithic 3D⁺IoT Chip Using Low Thermal Budget Laser Technology