10:40 〜 11:00

[H-3-04] Development of a technology platform using advanced die-first FOWLP for highly integrated flexible hybrid electronics

^○T. Fukushima^1,2, A. Alam¹, A. Hanna¹, S. C. Jangam¹, A. Bajwa¹, S. S. Iyer¹ (1.UCLA (USA), 2.Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2017.H-3-04