The Japan Society of Applied Physics

10:40 〜 11:00

[H-3-04] Development of a technology platform using advanced die-first FOWLP for highly integrated flexible hybrid electronics

T. Fukushima1,2, A. Alam1, A. Hanna1, S. C. Jangam1, A. Bajwa1, S. S. Iyer1 (1.UCLA (USA), 2.Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2017.H-3-04