15:00 〜 15:20

[H-4-04] Bonding and Debonding of Si/Glass based on SAB Method Combined with Hydrophilic Treatment

^○K. Takeuchi¹, Y. Matsumoto², T. Suga¹ (1.Univ. of Tokyo (Japan), 2.Lan Technical Service Co., Ltd. (Japan))

https://doi.org/10.7567/SSDM.2017.H-4-04