9:30 AM - 10:00 AM

[H-5-01 (Invited)] Advanced Packaging Technology to Address Micro-bump Solder Bonding and Warpage in Large-die 3D IC using 22nm ULK Dielectrics

^○K. Sakuma¹, J. Knickerbocker¹ (1.IBM T. J. Watson Research Center (USA))

https://doi.org/10.7567/SSDM.2017.H-5-01