10:40 〜 11:00

[H-5-04] Characterization of Cu-TSVs Fabricated by a New All-Wet Process

^○M. Xiong^1,2, Y. Yan², Y. Ding², H. Kino¹, T. Fukushima¹, T. Tanaka¹ (1.Tohoku Univ. (Japan), 2.Beijing Inst. of Tech. (China))

https://doi.org/10.7567/SSDM.2017.H-5-04