Fabrication of VTPC-TG Pixels for 3D Structure CMOS Image Sensor Applications

S.-K. Park

doi:https://doi.org/10.7567/SSDM.2017.H-6-03

12:00 〜 12:15

[H-6-03] Fabrication of VTPC-TG Pixels for 3D Structure CMOS Image Sensor Applications

S.-K. Park¹,^○D. Woo¹, M.-K. Na¹, P.-S. Kwag¹, H.-R. Lee¹, K.-W. Ro¹, K.-H. Kim¹, D.-K. Lee¹, C. Hong¹, I.-W. Cho¹, J.-H. Park², K.-D. Yoo² (1.SK Hynix (Korea), 2.Hanyang Univ. (Korea))

https://doi.org/10.7567/SSDM.2017.H-6-03

2017 International Conference on Solid State Devices and Materials

[H-6-03] Fabrication of VTPC-TG Pixels for 3D Structure CMOS Image Sensor Applications