The Japan Society of Applied Physics

12:15 〜 12:30

[H-6-04 (Late News)] Influence of different plasma treatments on low-temperature Au-Au bonding and its application to hermetic packaging

M. Yamamoto1, E. Higurashi1,2, T. Suga1, R. Sawada3, T. Itoh1 (1.Univ. of Tokyo (Japan), 2.AIST (Japan), 3.Kyushu Univ. (Japan))

https://doi.org/10.7567/SSDM.2017.H-6-04