Influence of different plasma treatments on low-temperature Au-Au bonding and its application to hermetic packaging

12:15 〜 12:30

[H-6-04 (Late News)] Influence of different plasma treatments on low-temperature Au-Au bonding and its application to hermetic packaging

^○M. Yamamoto¹, E. Higurashi^1,2, T. Suga¹, R. Sawada³, T. Itoh¹ (1.Univ. of Tokyo (Japan), 2.AIST (Japan), 3.Kyushu Univ. (Japan))