16:20 〜 16:40

[K-2-03] Comparisons of Wire Bonding and Flip-Chip Bonding Assembly in High Frequency Hysteretic DC-DC Buck Converters

^○Y. Karasawa¹, Y. Gotou¹, S. Hara¹, T. Fukuoka¹, K. Miyaji¹ (1.Shinshu Univ. (Japan))

https://doi.org/10.7567/SSDM.2017.K-2-03