[PS-2-07 (Late News)] Investigation of Transient Thermal Dissipation in Three-Dimensional Stacked ICs

^○Y. Araga¹, H. Shimamoto¹, S. Melamed¹, K. Kikuchi¹, M. Aoyagi¹ (1.AIST (Japan))

https://doi.org/10.7567/SSDM.2017.PS-2-07