The Japan Society of Applied Physics

15:45 〜 16:00

[B-6-02] Integration of Low-k Low Temperature 400°C SiCO as Offset Spacer in view of 3D Sequential Integration

C. Fenouillet-Beranger1, L. Brunet1, E. Arnoux1, V. Lu1, V. Beugin1, C. Guerin1, S. Del Medico2, V. Loup1, M.-P. Samson2, B. Previtali1, C. Tabone1, N. Rambal1, N. Rochat1, D. Benoit2, F. Allain1, G. Romano1, T. Artemisia1, M. Casse1, X. Garros1, H. Dansas1, A. Grenier1, P. Batude1, M. Vinet1 (1.Inst. CEA/LETI (France), 2.Indus. STMicroelectronics (France))

https://doi.org/10.7567/SSDM.2018.B-6-02