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[G-3-03] Ultrafine Pitch TSV Technology Using Directed Self-Assembly for 3D Storage Memory Systems

^○T. Fukushima¹, M. Murugesan¹, M. Koyanagi¹ (1.Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2018.G-3-03