09:45 〜 10:00

[G-3-03] Ultrafine Pitch TSV Technology Using Directed Self-Assembly for 3D Storage Memory Systems

^○T. Fukushima¹, M. Murugesan¹, M. Koyanagi¹ (1.Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2018.G-3-03