9:45 AM - 10:00 AM

[H-3-03] Heat Dissipation property of III-V on SiC Platform for Photonic Integrated Circuits

T. Sanjoh¹, N. Sekine¹, S. Takagi¹,^○M. Takenaka¹ (1.Univ. of Tokyo (Japan))

https://doi.org/10.7567/SSDM.2018.H-3-03