15:00 〜 15:15

[J-1-03] Characterization of Electroplated Cu Films by Combination of PALS, HIM, and EBSD

^○Y. Hara¹, M. Kodera¹, E. Webb¹, J. Sukamto¹, T. Ohdaira², S. Ogawa² (1.Moses Lake Indus. (USA), 2.AIST (Japan))

https://doi.org/10.7567/SSDM.2019.J-1-03