09:30 〜 09:45

[M-3-02] 3D SoC Design with TSV-less Power Supply Employing Highly Doped Silicon Via

^○K. Shiba¹, M. Hamada¹, T. Kuroda¹ (1.Keio Univ. (Japan))

https://doi.org/10.7567/SSDM.2019.M-3-02