Recent progress in sequential 3D device stacking: Low temperature reliable top tier junction-less devices on 300mm wafers.

A. Vandooren

doi:https://doi.org/10.7567/SSDM.2019.N-4-01

15:30 〜 16:00

[N-4-01 (Invited)] Recent progress in sequential 3D device stacking: Low temperature reliable top tier junction-less devices on 300mm wafers.

^○A. Vandooren¹, J. Franco¹, Z. Wu¹, B. Parvais¹, G. Besnard², W. Schwarzenbach², I. Radu², B.-Y. Nguyen², N. Collaert (1.imec (Belgium), 2.SOITEC (France))

https://doi.org/10.7567/SSDM.2019.N-4-01

2019 International Conference on Solid State Devices and Materials

[N-4-01 (Invited)] Recent progress in sequential 3D device stacking: Low temperature reliable top tier junction-less devices on 300mm wafers.