Bottom Tier High Voltage Vevice Thermal Stability in 3D Sequential Integration for More than Moore Applications

C. Cavalcante

doi:https://doi.org/10.7567/SSDM.2019.N-4-02

16:00 〜 16:15

[N-4-02] Bottom Tier High Voltage Vevice Thermal Stability in 3D Sequential Integration for More than Moore Applications

^○C. Cavalcante^1,2,3, G. Ghibaudo², X. Garros¹, M. Cassé¹, T. Karatsori², J. Lacord¹, C. Fenouillet¹, N. Rambal¹, O. Rozeau¹, J.P. Colinge¹, M. Vinet¹, D. Lattard¹, F. Andrieu¹, P. Batude¹ (1.Lab. CEA-LETI, MINATEC (France), 2.Inst. IMEP-LAHC, Grenoble INP (France), 3.Univ. Grenoble Alpes (France))

https://doi.org/10.7567/SSDM.2019.N-4-02

2019 International Conference on Solid State Devices and Materials

[N-4-02] Bottom Tier High Voltage Vevice Thermal Stability in 3D Sequential Integration for More than Moore Applications